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EE243 Advanced IC Processing and Layout
Spring 2010 Course Information

This course emphasizes the physical principles and models used in IC fabrication technology. It starts with an overview of the CMOS fabrication sequence, its key technology modules, and the issues that limit these processes. We then cover the front-end of the line (FEOL) processes: mechanisms and models for implantation, oxidation, and diffusion. We will discuss advanced models for optical image formation and resolution enhancement, resist response, defect printability, inspection and next generation nm-scale printing. Back end of the line (BEOL) processes include etching, physical depositions (sputtering) and chemical deposition (ALD and Epi), CMP, multilevel metallization, and heterogeneous integration. Contemporary issues such as high-k dielectric and strain engineering will be use as case studies of the modules. Extension of these process modules for flat panel displays, MEMS, Photovoltaics, and Nanotechnology will be discussed. The last 3 weeks cover basic statistical process control (SPC) and design of experiments (DOE) as used to support high yield manufacturing.

Course Materials

The materials used in this course have been co-developed with Professors Andy Neureuther and Costas Spanos. Notes for each lecture and some (but limited) reading materials will be distributed to class participants and posted on the class web.

Required Textbooks:

Plummer, Deal and Griffin, 'Silicon VLSI Technology: Fundamentals, Practice and Modeling', 2^nd Edition, Prentice Hall. 

SPC and DOE - Spanos and May. ‘Fundamentals of Sermiconductor Manufacturing and Process Control’ Chapters 4, 6 and 7(reprints will be available)

Homework

Homework assignments will be posted on the class webpage on Thursdays and are due 9 days after (Tuesdays). Homework submission can be done electronically through Bspace (https://bspace.berkeley.edu/) in pdf ,WORD, or jpeg format or as hardcopies in Cory 513.

Term Project

A term project related to state-of-the-art technology. The project can critique the pros and cons of an emerging technology; provide engineering design data and models; or apply a technology to novel situations. The use of TCAD tools or SPC methods are highly encouraged in these investigations. A short (10 min) web based presentation to class is required near the end of the semester.

Exam Schedule:

Midterm: About 8th Week of class, 2-hr exam

Final Exam: 3-hr exam

Grading Policy: Homework and Class Participation: 25% Project: 25% Midterm: 25% Final Exam: 25%

The lowest 2 HW scores will not count towards your overall course grade.

Last updated  1/21/2010

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