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EE143 Microfabrication Technologies
Fall 2010  Course Information

Teaching Staff:

Instructor : Prof. Nathan Cheung , Cory 513, 642-1615, cheung@eecs.berkeley.edu   

Lecture Hours : Tu,Th 2:10-3:30pm, Wheeler 220

 

Prof Cheung's Office Hours: Tuesday 1-2pm, Thursday 3:30-4:30pm. and by appointment, CORY 513

 

TA Office Hours

Byron Ho (Head-TA), bho@eecs.berkeley.edu, Friday 12-1pm CORY 382

Chenlu Hou, clhou@berkeley.edu, Monday 1:30-2:30 pm, CORY 382

Wookhyun Kwon, whkwon10@eecs.berkeley.edu, Wed 1-2pm, CORY 382

 

Homework Reader

John Gerling, jgerling@berkeley.edu

 

COURSE DESCRIPTION

 

Prerequisite: EE40/E100 and Physics 7B or equivalent,  http://www-inst.eecs.berkeley.edu/~ee40/

EE143 teaches the fundamentals of integrated-circuit (IC) fabrication and surface-micromachining technology, giving the student a basic understanding of IC and micromachining processes and the effect of processing choices on device performance. Students learn to use process simulation tools and also fabricate and characterize devices in the laboratory. This lecture part will cover the processing techniques and design methodologies of microfabrication. We will discuss the process modules: lithography, thermal oxidation, diffusion, ion implantation, etching, thin-film deposition, epitaxy, metallization. The second part of the course will cover process simulation, layout design rules, MOS, IC, and MEMS  process integration. The laboratory part of the course will provide students opportunities to have hands-on experience to fabricate and characterize a NMOS chip with  simple MEMS components.  

 

Homework: Homework assignments will be posted online every Tue, due by 9am the following Friday.

Your best ten efforts will be counted towards your course grade.

 

LAB : Lab attendance is mandatory. Students will work as teams of two. Grading will be based two lab reports and your lab participation.

 

Grading:   Midterm1 15%, Midterm2 15%, Final 30% ,Homework 10%, Lab 30% 

(Undergrad and Grad students will be graded as two separate groups)


Textbooks: 

1) Required  EE143 Reprints and Lecture Notes

2) Required  R.C. Jaeger "Introduction To Microelectronics Fabrication ", 2nd Edition, Prentice Hall  

References:

W. Maly, Atlas of IC Technologies (excellent 3D drawings of IC Structures)

M. Madou, Fundamentals of Microfabrication, CRC Press (MEMS technology)

S. Campbell, The Science and Engineering of Microelectronic Fabrication ,3rd Edition (Intermediate/ Advanced Text)

Plummer, Deal and Griffin, Silicon VLSI Technology, Prentice Hall (Advanced Text on mechanisms and modeling)

Ben Streetman, Solid State Electronic Devices”, Prentice Hall, 5th Edition (Quick introduction to devices)

 

Fall 2010 Lecture Schedule

 

Week #

Topics

Required Reading

   1 (8/26)

Course overview and introduction

(NO HOMEWORK ASSIGNMENT THIS WEEK)  

http://jas.eng.buffalo.edu/education/fab/pn/diodeframe.html

http://jas.eng.buffalo.edu/education/fab/invFab/index.html

http://www-inst.eecs.berkeley.edu/~ee143/fa10/lab.html

2 (8/30)

Introduction to process modules, process flow, and electronic materials.

IC and MEMS Device Structures.

Jaeger Chapter 1

Reader : Introduction to IC Devices, http://www-inst.eecs.berkeley.edu/~ee143/fa10/handouts/IC_devices.pdf

3 (9/6)

Lithography 

 

Jaeger Chap 2

Standing Wave Notes, http://www-inst.eecs.berkeley.edu/~ee143/fa10/handouts/standing_wave_notes.pdf

4 (9/13)

Thermal Oxidation 

Jaeger Chap 3

Reader [Mayer-Lau, Chapter 9]

5 (9/20)

Dopant engineering :Ion Implantation

Jaeger Chap 5

Reader [Mayer-Lau, Chapter 8]

6 (9/27)

Dopant engineering: Diffusion

Jaeger Chap 4

Reader [Sections of Wolf Chapter 9 on Diffusion]

7 (10/4)

Thin Film Deposition

Jaeger Chap 6

Reader [Sections of Campbell Chap 13 - CVD]

Reprint: What is a Vacuum  

 8 (10/11)

Midterm Exam #1 (10/12) Barrows 166 

Etching

Reader [Anner, Chapter 10 Etching]

9 (10/18)

Metallization, Planarization

Jaeger Chap 7

Reader [Campbell, Chap 15 on Isolation and Metallization]

10 (10/25)

MOS Integration

Reader [Maly, Atlas of ICs]  

Jaeger Chap 9

11 (11/1)

Layout, Devices Physics

Reader [Uyemura, Design Rule Basics]

12 (11/8)

MOS Design

(11/11) Veterans Day

Reader [ Streetman, Chap 8.3,  MOS Principle]

13 (11/15)

Midterm Exam #2 (11/16) Moffitt 101 

MOS Characteristics

Reader [ Streetman, Chap 8.3,  MOS Principle]

14 (11/22)

MEMS Structures and Fabrication 

Thanksgiving (11/24)

Jaeger Chap 11

Reader [Kovac, Chapter 3 on Mechanical Transducers]  

15 (11/29)  

MEMS Structures and Fabrication 

Jaeger Chap 11

Reader [Kovac, Chapter 3 on Mechanical Transducers]  

16

(12/6)

RRR Week 

Topics of contemporary interest

Nanofabrication,

Solar Cells, LEDs

Lecture Notes and Reprints  

 

Final Exam 12/14 (Tue)  8-11am

 

 

Last updated  11/14/2010

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