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Lecture
Notes Homework and
Exams Handouts Past EE143
EE243 Advanced IC Processing and Layout
Spring 2012 Course Information
This
course starts with a generic overview of the CMOS fabrication sequence, key
technology modules, and processing limitations and issues.
Front-end of the line (FEOL)
processes:
mechanisms and models for implantation, oxidation, diffusion, and substrate
engineering.
Patterning: advanced models for optical
image formation and resolution enhancement, resist response, defect
printability, inspection, and nm-scale printing.
Back end of the line (BEOL)
processes include
deposition and etching (PVD,CVD, ALD, Epi, RIE, ALE), CMP, metallization, and heterogeneous
integration of microsystems.
Contemporary
issues such as gate stack engineering, strain engineering, and nonplanar devices (FINFET) will be used as case studies
throughout the course. Extension of
these process modules for displays, MEMS, Photovoltaics,
and Nanotechnology will also be discussed.
The last
3 weeks cover basic statistical process control (SPC) and design of experiments
(DOE) as used to support high yield manufacturing.
Course
Materials
The
materials used in this course have been co-developed with Professors Andy Neureuther and Costas Spanos.
Notes for each lecture and some reading materials will be distributed to class
participants via BSpace.
Required
Textbooks:
Plummer,
Deal and Griffin,
'Silicon VLSI Technology: Fundamentals, Practice and Modeling', 1st Edition
(2000), Prentice Hall.
SPC
and DOE - Spanos and May. ‘Fundamentals of Sermiconductor Manufacturing and Process Control’ Chapters
4, 6 and 7( pdf reprints
will be available to all enrolled students)
Homework
Homework
assignments will be posted on the class webpage on Tuesdays and are due 10 days
after (Fridays). Homework can be submitted electronically
to the dropbox of Bspace
(https://bspace.berkeley.edu/) in pdf (preferred) ,WORD, or jpeg formats. All graded homework will be
returned to your dropbox in pdf
format.
Hardcopies of homework will also be accepted in Cory
513 (BY SLIDING THEM UNDER THE DOOR) . The lowest
score of the homework set will not count towards the course grade.
Term
Project
A term
project related to state-of-the-art technologies. The project can critique the pros and cons of an
emerging technology; provide engineering design data and models; or apply a
technology to novel situations. The use of TCAD tools or SPC
methods are highly encouraged in these investigations. A short (10 min)
web based presentation to class is required near the end of the semester.
Exam
Schedule:
Midterm: About 8th Week of class, 2-hr exam
Final
Exam: 3-hr exam
Grading
Policy: Homework
and Class Participation: 25% Project: 25% Midterm: 25% Final Exam: 25%
The
lowest 2 HW scores will not count towards your overall course grade.
Last updated 1/3/2012
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