EE 243 (Spring 2012)
Advanced IC Processing and Layout

EE143 covers the undergraduate level microfabrication topics. Past course materials are posted here for your reference.

• EE143 Course Reader (47 Mbytes)

Lectures

• Lec_01 Introduction
• Lec_02 Overview
• Lec_03 Semiconductor Physics
• Lec_04 Device Structures and Simple Process Flows
• Lec_05 Thermal Oxidation
• Lec_06 Thermal Oxidation
• Lec_07 Ion Implanation
• Lec_08 Ion Implantation
• Lec_09 Dopant Diffusion
• Lec_10 Dopant Diffusion
• Lec_11 Photolithography
• Lec_12 Lithography
• Lec_13 Physical Vapor Deposition
• Lec_14 Chemical Vapor Deposition
• Lec_15 Etching
• Lec_16 Reactive Ion Etching
• Lec_17 Metallization
• Lec_18 Planarization
• Lec_19 Layout Design Rules
• Lec_20 Process Integration
• Lec_21 Process Integration
• Lec_22 Metal Oxide Semiconductor
• Lec_23 MOSFET
• Lec_24 MEMS Fabrication
• Lec_25 MEMS Process Flows
• Lec_26 Final Exam Review
• Lec_27 Nanoscale Processing
• Lec_28 Trends of IC Fabrication

Homework and Solutions

• Homework #1
• Homework #1 solutions
• Homework #2
• Homework #2 solutions
• Homework #3
• Homework #3 solutions
• Homework #4
• Homework #4 solutions
• Homework #5
• Homework #5 solutions
• Homework #6
• Homework #6 solutions
• Homework #7
• Homework #7 solutions
• Homework #8
• Homework #8 solutions
• Homework #9
• Homework #9 solutions
• Homework #10
• Homework #10 solutions
• Homework #11
• Homework #11 solutions
• Homework #12
• Homework #12 solutions
• Midterm Exam
• Midterm Exam solutions

Last updated  1-21-2012
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