NEW (updated on 12/21/01): Check the final exam and final solution here.
Take-home final: Dec. 10 to Dec. 14. Exam must be
postmarked or faxed by Friday, Dec. 14.
Common MEMS acronyms.
NEW: Here's the Project assignment.
NOTE: The solution of homework won't be posted on the website any more. It will be sent to you by mail right after you turn in the homework.
||Kristofer S.J. Pister
firstname.lastname@example.org <-- easiest method of contact
|Course Consultant||Lixia Zhou
office hours: 12pm-2pm P.T., Tuesday and Thursday
||Madou, Fundamentals of Microfabrication
Elwenspoek & Jansen, Silicon Micromachining
Sze, Semiconductor Sensors
Ristic, Sensor Technology and Devices
Senturia, Microsystem Design
Kovacs, Micromachined Transducers Sourcebook
Maluf, an Introduction to Microelectromechanical Systems Engineering
Jaeger, Introduction to Microelectonic Fabrication
|Homework||Will emphasize design, layout, and simulation of devices and systems
Collaboration is encouraged! Cheating is not!
|Project||Project Abstract is due Tuesday, Nov. 6.
Writeup is due Friday, Dec. 7. Four pages max, two column format, no exceptions!
|Final Exam||Tentatively on Dec. 14.|
|Introduction: what is MEMS, and what subset will ee245 cover?
Basic IC fabrication: deposition, lithography, oxidation, etching
IC fabrication continued
Basic IC fabrication continued (handout)
etching, Sputtering, RIE, 1, 2 and 3 mask level processes.
Wet etching (anisotropic and isotropic), crystal directions in Si
etching continued, DRIE (Petersen's paper)
Bulk micro-machining, wafer bonding, SOI
micro-machining, semiconductor material properties
Material properties (semiconductor physics)
|HW4 MS Word
to MEMS devices (handout)
Stress, strain, introduction to beam theory
Guest lecture: Veljko Milanovic on CMOS and MEMS in CMOS
|HW5 MS Word
Electrostatics continued, introduction to electrostatic actuators
actuators / motors continued
Electrostatic actuators / motors continued
|HW6 MS Word
overview, thermal actuators
Lateral resonators (comb drive), damping
lecture: Prof. Dorian Liepmann on microfluidics
Resonance (transfer function), Q
#23 – Resonance continued
Hierarchical design, Introduction to Cronos/MUMPS process flow, design rules
|HW7 MS Word
process flow, two poly level devices
NO CLASS: Thanksgiving Holiday
process flow, test structures, sensors, piezo-resistance, bridge circuit
Piezo-resistance, bridge circuit, force sensor, accelerometer, introduction to noise
noise equivalents, amplification of signals
Review of past exams, overview of things not covered in the course
Check your grade here.
For your broad interests in MEMS:
Berkeley Sensor and Actuator Center
MEMS at Sandia Labs
MEMS at Stanford