IC 792CA/EECS 245: Intro to MEMS Design

Fall 2001

NEW (updated on 12/21/01): Check the final exam and final solution here.

Take-home final: Dec. 10 to Dec. 14. Exam must be postmarked or faxed by Friday, Dec. 14.

Common MEMS acronyms.
NEW:
Here's the Project assignment.
NOTE: The solution of homework won't be posted on the website any more. It will be sent to you by mail right after you turn in the homework.
 
Instructor 
 
Kristofer S.J. Pister 
pister@eecs.berkeley.edu <-- easiest method of contact 
Course Consultant Lixia Zhou
lzhou@eecs.berkeley.edu
office hours: 12pm-2pm P.T., Tuesday and Thursday
Suggested References 
 
Madou, Fundamentals of Microfabrication
Elwenspoek & Jansen, Silicon Micromachining
Sze, Semiconductor Sensors
Ristic, Sensor Technology and Devices
Senturia, Microsystem Design
Kovacs, Micromachined Transducers Sourcebook
Maluf, an Introduction to Microelectromechanical Systems Engineering
Jaeger, Introduction to Microelectonic Fabrication
Grading
Homework 40%
Project 30%
Final 30%
Homework Will emphasize design, layout, and simulation of devices and systems 
Collaboration is encouraged!  Cheating is not!
Project Project Abstract is due Tuesday, Nov. 6.
Writeup is due Friday, Dec. 7.  Four pages max, two column format, no exceptions! 
Final Exam Tentatively on Dec. 14.



Schedule
Week Date Topic HW Solutions/
Grades
1 8/28
8/30
Introduction: what is MEMS, and what subset will ee245 cover?
Basic IC fabrication: deposition, lithography, oxidation, etching
HW1 Solution
2 9/4
9/6
Basic IC fabrication continued
Basic IC fabrication continued (handout)
HW2 Solution
3 9/11
9/13
Plasma etching, Sputtering, RIE, 1, 2 and 3 mask level processes.
Wet etching (anisotropic and isotropic), crystal directions in Si
HW3 Solution
4 9/18
9/20
Wet etching continued, DRIE (Petersen's paper)
Bulk micro-machining, wafer bonding, SOI
   
5 9/25
9/27
Bulk/Surface micro-machining, semiconductor material properties
Material properties (semiconductor physics)
HW4 MS Word
HW4 PDF
Solution
6 10/2
10/4
Introduction to MEMS devices (handout)
Stress, strain, introduction to beam theory
   
7 10/9
10/11
Beam Theory
Guest lecture: Veljko Milanovic on CMOS and MEMS in CMOS
HW5 MS Word
HW5 PDF
Solution
8 10/16
10/18
Introduction to electrostatics
Electrostatics continued, introduction to electrostatic actuators
   
9 10/23
10/25
Electrostatic actuators / motors continued
Electrostatic actuators / motors continued
HW6 MS Word
HW6 PDF
Solution
10 10/30
11/1
Project overview, thermal actuators
Lateral resonators (comb drive), damping
11 11/6
11/8
Guest lecture: Prof. Dorian Liepmann on microfluidics
Resonance (transfer function), Q
   
12 11/13
11/15
Lecture #23 Resonance continued
Hierarchical design, Introduction to Cronos/MUMPS process flow, design rules
HW7 MS Word
HW7 PDF
Solution
13 11/20
11/22
Cronos/MUMPS process flow, two poly level devices
NO CLASS: Thanksgiving Holiday
 
14 11/27
11/29
Cronos/MUMPS process flow, test structures, sensors, piezo-resistance, bridge circuit
Piezo-resistance, bridge circuit, force sensor, accelerometer, introduction to noise
15 12/4
12/6
Noise, noise equivalents, amplification of signals
Review of past exams, overview of things not covered in the course

Check your grade here.

For your broad interests in MEMS:


Berkeley Sensor and Actuator Center
MEMS at Sandia Labs
MEMS at Stanford