NEW (updated on 12/21/01): Check the final exam and final solution here.
Take-home final: Dec. 10 to Dec. 14. Exam must be
postmarked or faxed by Friday, Dec. 14.
Common MEMS acronyms.
NEW: Here's the Project
assignment.
NOTE: The solution of homework won't
be posted on the website any more. It will be sent to you by mail right
after you turn in the homework.
Instructor
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Kristofer S.J. Pister
pister@eecs.berkeley.edu <-- easiest method of contact |
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Course Consultant | Lixia Zhou lzhou@eecs.berkeley.edu office hours: 12pm-2pm P.T., Tuesday and Thursday |
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Suggested References
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Madou, Fundamentals of Microfabrication Elwenspoek & Jansen, Silicon Micromachining Sze, Semiconductor Sensors Ristic, Sensor Technology and Devices Senturia, Microsystem Design Kovacs, Micromachined Transducers Sourcebook Maluf, an Introduction to Microelectromechanical Systems Engineering Jaeger, Introduction to Microelectonic Fabrication |
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Grading |
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Homework | Will emphasize design, layout, and simulation of devices and systems
Collaboration is encouraged! Cheating is not! |
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Project | Project Abstract is due Tuesday, Nov. 6. Writeup is due Friday, Dec. 7. Four pages max, two column format, no exceptions! |
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Final Exam | Tentatively on Dec. 14. |
Week | Date | Topic | HW | Solutions/
Grades |
1 | 8/28
8/30 |
Introduction: what is MEMS, and what subset will ee245 cover?
Basic IC fabrication: deposition, lithography, oxidation, etching |
HW1 | Solution |
2 | 9/4
9/6 |
Basic
IC fabrication continued
Basic IC fabrication continued (handout) |
HW2 | Solution |
3 | 9/11
9/13 |
Plasma
etching, Sputtering, RIE, 1, 2 and 3 mask level processes.
Wet etching (anisotropic and isotropic), crystal directions in Si |
HW3 | Solution |
4 | 9/18
9/20 |
Wet
etching continued, DRIE (Petersen's paper)
Bulk micro-machining, wafer bonding, SOI |
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5 | 9/25
9/27 |
Bulk/Surface
micro-machining, semiconductor material properties
Material properties (semiconductor physics) |
HW4 MS Word HW4 PDF |
Solution |
6 | 10/2
10/4 |
Introduction
to MEMS devices (handout)
Stress, strain, introduction to beam theory |
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7 | 10/9
10/11 |
Beam Theory
Guest lecture: Veljko Milanovic on CMOS and MEMS in CMOS |
HW5 MS Word HW5 PDF |
Solution |
8 | 10/16
10/18 |
Introduction
to electrostatics
Electrostatics continued, introduction to electrostatic actuators |
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9 | 10/23
10/25 |
Electrostatic
actuators / motors continued
Electrostatic actuators / motors continued |
HW6 MS Word HW6 PDF |
Solution |
10 | 10/30
11/1 |
Project
overview, thermal actuators
Lateral resonators (comb drive), damping |
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11 | 11/6
11/8 |
Guest
lecture: Prof. Dorian Liepmann on microfluidics
Resonance (transfer function), Q |
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12 | 11/13
11/15 |
Lecture
#23 – Resonance continued
Hierarchical design, Introduction to Cronos/MUMPS process flow, design rules |
HW7 MS Word HW7 PDF |
Solution |
13 | 11/20
11/22 |
Cronos/MUMPS
process flow, two poly level devices
NO CLASS: Thanksgiving Holiday |
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14 | 11/27
11/29 |
Cronos/MUMPS
process flow, test structures, sensors, piezo-resistance, bridge circuit
Piezo-resistance, bridge circuit, force sensor, accelerometer, introduction to noise |
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15 | 12/4
12/6 |
Noise,
noise equivalents, amplification of signals
Review of past exams, overview of things not covered in the course |
For your broad interests in MEMS:
Berkeley Sensor and Actuator Center
MEMS at Sandia Labs
MEMS at Stanford