The class can have two categories of subjects. The first category (marked A) could be subjects that are currently applicable in state of the art IC manufacturing. The second category (marked B) can be a listing of more speculative subjects, namely in-situ metrology and its applications in reducing product variability. We can choose from the following: 1. Yield (we can get lots of material from KLA-Tencor on some of this) Modeling (Standard probabilistic modeling for parametric and catastrophic yield, layer-by-layer modeling, yield predictions for next generation products). Measuring (test patterns and associated metrology, electrical testing for parametric conformance, particle counting in-situ and on-wafer). estimated length 2 weeks (6 hours of lecture) 2. Process / Machine Modeling DOE (A) (Statistical background and basic stuff, such as fractional factorials) (2 weeks) Model fitting (A) (regression for static experiments / process ID for controller designs) (2 weeks) Variability Analysis methods (ANOVA (A) and spatial freequency analysis (B) applications in pattern variability analysisas applied to patterning, data from Motorola and National) (1 week) estimated length 5 weeks 3. Process Control SPC (A) (Basic idea of Shewhart chart) (1 week) RTR (EWMA) (B) (Applications in Lithography and CMP) (1 week) Real-time (??) estimated length 3 weeks 4. Sensors Thin Film (A) (Reflectometry/Ellipsometry, FTIR) (Standard methods, basic E&M description, relative advantages of each method) CD (Etest (A), SEM (A), Scatterometry (B)) Sensor integration platforms (B) (one lecture on current state of IC industry and SIA effort under way) On-wafer sensors (B) (one to two lectures on futuristic material and possible benefits to industry) estimated length 2 weeks 5. Computer Integrated Manufacturing Infrastructure Could get a guest industrial lecture on integration issues from IBM or AMD (A), Could get a guest CS lecture on the applicability of internet technology in IC production (B) estimated length 1 week