University of California, Berkeley

Electrical Engineering and Computer Sciences Department

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Fall 2012 Lecture Notes:

No. Date Lecture Module PDF Reading
1 Aug. 23 Administrative Information, Overview and Introduction to MEMS 1
[PDF]
[PDF]
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S: §1.1-1.4
2 Aug. 28 Benefits of Scaling I: faster speed (transistors, micromechanical resonators) 2
[PDF]
[PDF]
[PDF]
none
  *Aug. 30, this lecture was absorbed into longer lectures on the following days.       none
3 Sept. 4 Benefits of Scaling II: lower power consumption (micro-ovens)   [PDF]
[PDF]
none
4 Sept. 6 Benefits of Scaling III: higher sensitivity (gas sensors)   [PDF] none
5 Sept. 11 Fabrication Process Modules I: oxidation, film deposition, lithography 3
[PDF]
[PDF]
[PDF]
[PDF]
S: §3.1-3.2.3,  §3.2.6,  §3.3.1
J: §2.1,  §2.3-2.5,  §3.1-3.3,  §3.6,  §6.1-6.3
6 Sept. 13 Fabrication Process Modules II: etching, ion implantation, diffusion 4
[PDF]
[PDF]
[PDF]
[PDF]
S: §3.2.5,  §3.3.4.1,  §3.3.5-3.3.6
J: §2.2,  §4.1-4.5,  §5.1-5.5
7-8 Sept. 18 Fabrication Process Modules III: Etching: wet etching, dry etching; Semiconductor doping: ion implantation; diffusion   [PDF]
[PDF]
S: Chapter 3
J: Chapters 2, 4, 5
9 Sept. 20 Surface Micromachining I: Polysilicon surface micromachining 5
[PDF]
[PDF]
[PDF]
S: Chapter 3
J: Chapter 11
10 Sept. 25 Surface Micromachining II: Stiction   [PDF]
[PDF]
Surface Micromachining for Microelectrical Systems
Etch Rates for Micromachining Processing
Etch Rates for Micromachining Processing - Part II
11 Sept. 27 Surface Micromachining II (cont.): Residual stress, topography issues, nickel metal surface micromachining, 3D "pop-up" MEMS, Foundry MEMS: the "MUMPS" process, the Sandia SUMMIT process

Bulk Micromachining: Anisotropic Etching of Silicon

6
[PDF]
[PDF]
[PDF]
[PDF]
S: §3.3.4.2-3.3.4.3
J: §11.2-11.3,  §11.6
12 Oct. 2 Bulk Micromachining (cont.): Boron-doped etch stop, electrochemical etch stop, isotropic etching of silicon, Deep Reactive Ion Etching (DRIE), Wafer bonding

Mechanics of Materials for MEMS I: stress, strain, etc., for isotropic materials

7
[PDF]
[PDF]
[PDF]
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S: §8.1-8.2,  §8.4
13 Oct. 4 Mechanics of Materials for MEMS II: Thin films: thermal stress, residual stress, and stress gradients; internal dissipation, MEMS material properties and performance metrics 8
[PDF]
[PDF]
[PDF]
S: Chapter 8
14 Oct. 9 Beam bending I   [PDF]
[PDF]
S: Chapter 9
15 Oct. 11 Stress Gradients 9
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[PDF]
[PDF]
S: Chapter 9
16 Oct. 16 Beam Combos I   [PDF]
[PDF]
S: Chapter 9
17 Oct. 18 Beam Combos II   [PDF]
[PDF]
S: Chapter 9
18 Oct. 23 Energy Methods

Resonance Frequency

10
[PDF]
[PDF]
[PDF]
[PDF]
S: Chapter 10
  Oct. 25 MIDTERM EXAM      
19 Oct. 30 Resonance Frequency   [PDF] S: §10.5; Chapter 19
20 Nov. 1 Resonance Frequency

Equivalent Circuits I

11
[PDF]

12
[PDF]

[PDF]
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[PDF]
S: Chapters 5 and 6
21 Nov. 6 Capacitive Transducers   [PDF] S: Chapters 5 and 6
22 Nov. 8 Electrical Stiffness   [PDF]
[PDF]
S: Chapters 5 and 6
  Nov. 13: This lecture was absorbed into longer lectures on following days        
23-24 Nov. 15 Comb Drive

Equivalent Circuits II

13
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S:   Chapters 5, 6 and 14
25 Nov. 20 Sensing Circuits I

Gyros, Noise and MDS

14
[PDF]

15
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S: Chapters 14, 16 and 21
  Nov. 22 THANKSGIVING - HOLIDAY      
26 Nov. 27 Gyroscopes and Sensing Circuits   [PDF]
[PDF]
S: Chapters 14, 16 and 21
27 Nov. 29 Sensing Circuits II   [PDF]
[PDF]
S: Chapter 14
  Dec. 4 Reading/Recitation/Review Day - No Lecture      
  Dec. 6 Reading/Recitation/Review Day - No Lecture      
  Dec. 14 FINAL EXAM: Friday, Dec. 14, 7-10 p.m.      

NOTE:  * The asterisks indicate days that I will not be in town. On these dates, I will make appropriate arrangements for the lecture, which will probably entail doing and recording
(for website posting) a make-up lecture at a specified time and location.


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 Last updated 11/30/12 by LB