EE143 Microfabrication Technologies
Fall 2005 Course
Information
Teaching Staff:
Instructor :
Prof. Nathan Cheung , Cory 513, 642-1615, cheung@eecs.berkeley.edu
Lecture Hours : Tu,Th 9:40-11am, Etcheverry 3106
Prof Cheung's Office Hours: Tu 12-2pm, W 1-2pm
TA Office Hours
Vidya Varadarajan vidya@eecs.berkeley.edu, Head-TA , W 10-11am, Cory 382
Pei-Yu Chiou pychiou@eecs.berkeley.edu, Tu 4-5pm, HMB 110
Shong Yin shong2@uclink.berkeley.edu, W 9-10am, Cory 382
Frank Jesse Zendejas zendejas@eecs.berkeley.edu, M 1-2pm, Cory 382
Homework Reader
Shong Yin shong2@uclink.berkeley.edu
JCourse Description:
EE143
teaches the fundamentals of integrated-circuit (IC) fabrication and surface-micromachining
technology, giving the student a basic understanding of IC and micromachining
processes and the effect of processing choices on device performance. Students
learn to use process simulation tools and also fabricate and characterize
devices in the laboratory. This lecture part will cover the processing
techniques and design methodologies of microfabrication. We will discuss the
process modules: lithography, thermal oxidation, diffusion, ion implantation,
etching, thin-film deposition, epitaxy, metallization. The second part of the
course will cover process simulation, layout design rules, MOS, IC, and MEMS
process integration. The laboratory part of the course will provide
students opportunities to have hands-on experience to fabricate and
characterize a NMOS chip with simple
MEMS components.
Homework:
Homework assignments will be handed out every Tue, due in class the following
Thur.
Midterm Exam 1 10/12(wed), 6:00-7:30pm, CORY 241 and 247, closed book exam, 4 sheets of handwritten notes allowed
Midterm#1 Statistics: AVG=68, DEV=17, Median=71, High=91, Low=28. Maximum possible score=97.
Midterm Exam 2 11/9 (wed) 6:00-7:30pm, VALLEY Room 2060 LSB, 8 sheets of handwritten notes allowed
Midterm#2
Statistics: AVG=77, DEV=12, Median=79, High=100, Low=40.
Lab
Report 1: Friday November 18, before 3pm. Leave reports with Rosita in
Cory 253.
Lab Report 2: Monday December 12, before 3pm. Leave reports with Rosita in Cory
253.
Grading: Midterm1 15%,Midterm2 15%, Final 30% ,Homework 10%, Lab 30%
(Undergrad and Grad students will be graded as two separate groups)
Prerequisite: EE40/E100 and Physics 7B or equivalent, http://www-inst.eecs.berkeley.edu/~ee40/
Textbooks:
1)
Required EE143 Reader and lecture notes
2)
Required R.C. Jaeger "Introduction To Microelectronics Fabrication
", 2nd Edition, Prentice Hall
References:
W.
Maly:"Atlas of IC Technologies" (excellent 3D drawings of IC
Structures)
M.
Madou, “Fundamentals of Microfabrication,” CRC Press (MEMS technology)
S.
Campbell: "The Science and Engineering of Microelectronic Fabrication"
,2nd Edition (Intermediate/ Advanced Text)
Plummer,
Deal and Griffin, “Silicon VLSI Technology,” Prentice Hall (Advanced Text on
mechanisms and modeling)
Ben
Streetman, “Solid State Electronic Devices”, Prentice Hall, 4th
Edition (Quick introduction to devices)
Fall 2005 Teaching Schedule
Week # |
Topics |
Required
Reading |
| 1(8/29) |
IC
and MEMS Microfabrication Overview, (NO
HOMEWORK ASSIGNMENT THIS WEEK) |
Bank, “Introduction to Microengineering” http://www.dbanks.demon.co.uk/ueng/
|
|
2
(9/5) |
IC
and MEMS device structures Simple
process sequence Semiconductor
mobile carriers |
Jaeger
Chapter 1, Reader [Introduction to IC Devices, www.icknowledge.com] Reader
[Streetman Chap 3, Energy bands and charge carriers in semiconductors] |
|
3(9/12) |
Thermal
Oxidation and Applications |
Jaeger
Chap 3 Reader
[Mayer-Lau, Chapter 9] |
|
4(9/19) |
Dopant
engineering :Ion Implantation |
Jaeger
Chap 5 Reader
[Mayer-Lau, Chapter 8] |
|
5(9/26) |
Dopant
engineering: Diffusion |
Jaeger
Chap 4 Reader
[Wolf, Chap 8 Diffusion in Si] |
|
6(10/3) |
Lithography
|
Jaeger
Chap 2 Reader
[Sze, Chapter 11 on
lithography] |
|
7(10/10) |
Midterm Exam #1 10/12 (wed) 6:00-7:30pm |
Jaeger
Chap 6 Reader
[Campbell -Chapter 13 on CVD] Reprint
What is a Vacuum, Sputtering Deposition |
|
8
(10/17) |
Etching |
Reader
[Anan ,Chap 10 on Etching] |
|
9(10/24) |
Metallization,
Planarization |
Jaeger
Chap 7 Reader
[Campbell, Chap 15 on Isolation and Metallization] |
|
10
(10/31) |
Process
Integration, MOS basics |
Jaeger
Chap 9 |
|
11(11/7) |
MOS
Devices, Layout Design Rules, Midterm Exam #2 11/9 (wed) 6:00-7:30pm
|
Jaeger
Chap 9 Reader
[ Streetman, Chap 8.3, MOS
Principle] Reader
[Uyemura, Chap 3] |
|
12(11/14) |
CMOS
Process Integration, |
Reader[Chen,
Chap 5 on CMOS Integration], |
|
13(11/21) |
MEMS
structures and processing techniques
|
Jaeger
Chap 11 Reader
[Kovac, Chapter 3 on Mechanical Transducers] |
|
14
(11/28) |
MEMS
Process Integration |
Reader
[Kovac, Chapter 3 on Mechanical Transducers] |
|
15(12/5) |
Nanofabrication,
Recent Developments |
Lecture
Notes and Reprints |
Some useful info:
If your IE Browser cannot run applets at the http://jas.eng.buffalo.edu/ site, download java runtime environment from www.java.com
To run lab videos:
I can't get the lab module videos on the EE 143 website to work on my computer
at home. Windows media player gives me the following error message:
"The server received invalid data from the client on the control
connection."
Solution: It's actually a TCP/IP network level message. If you
are running a firewall make sure your firewall doesn't block the traffic for
windows media player program. If you are running a VPN client, turn off your
VPN client and try again. Also on your Windows media player remove the
support for UDP and TCP "just keep the HTTP as an active protocol".
* Open Windows Media Player
* Choose "Tools" from the
top menu
* Choose "Options" in the
tools menu
* Click on the "Network"
tab
* Remove the checks from the boxes
next to "Multicast", "UDP" and "TCP" just keep
the HTTP active
* Click on "OK"
* Close Windows media player
* Try the streaming videos again
Khossrov Taherian
http://california.eecs.berkeley.edu/khossrov
Last updated 9/30/2005
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